Agentic OS for
Semiconductor Fabs
Tenaxis brings AI governance to semiconductor manufacturing, automating process control, yield optimization, design workflows, and policy-backed auditability across your fab operation.
What Tenaxis Offers for Semiconductor
Purpose-built agentic workflows for every stage of the semiconductor value chain.
Process Control Automation
Real-time monitoring of fab parameters with automated SPC excursion detection and corrective action triggers.
Yield Optimization
AI-driven wafer map analysis to identify defect patterns and recommend process corrections that improve die yield.
Equipment Qualification & Maintenance
Automated equipment qualification workflows, predictive maintenance scheduling, and calibration tracking.
Design Automation (EDA)
RTL coding, DRC verification, SPICE simulation, and tapeout coordination, all agent-driven with human review gates.
Export-Control Review
Configurable screening and approval workflows for cross-border shipments and technology transfers, with evidence captured for legal and compliance review.
Supply Chain Visibility
Track wafer starts, material inventory, and supplier lead times with predictive bottleneck detection.
Failure Analysis Workflows
Classify failure modes from SEM images and electrical data, generating root cause reports automatically.
Contamination & Defect Analysis
Cleanroom monitoring workflows aligned to your contamination-control procedures, with traceability for ISO 14644-style evidence collection.
Semiconductor AI Agents
Pre-built agents ready to deploy in your fab, each governed, auditable, and configurable.
RTL Design Agent
DesignAutomates RTL coding and microarchitecture decisions from spec documents using LLM reasoning.
DRC Verification Agent
VerificationRuns Design Rule Checks, parses violation reports and suggests layout fixes automatically.
SPICE Sim Agent
DesignSets up and interprets SPICE simulations for analog and mixed-signal circuits.
Process Control Agent
ManufacturingMonitors fab process parameters, detects SPC excursions and triggers corrective actions.
Yield Optimization Agent
YieldAnalyzes wafer maps, identifies defect clusters and recommends process corrections to improve yield.
Failure Analysis Agent
TestingClassifies failure modes from SEM images and electrical data, generates root cause reports.
ATPG Test Agent
TestingGenerates Automatic Test Pattern Generation vectors and evaluates fault coverage.
Supply Chain Agent
Supply ChainTracks wafer starts, material inventory and predicts supply bottlenecks for on-time delivery.
Tapeout Coordinator
ManufacturingManages tapeout checklist, coordinates between design, PDV and foundry teams end-to-end.